Key Companies Included : Advanced Micro Devices, Inc. (United States) , Qualcomm Technologies Incorporated (United States) , Texas Instruments Incorporated (United States) , Nvidia Corporation (United States) , Toshiba Corporation (Japan) , NXP Semiconductors (Netherlands) , Intel Corporation (United States) , IBM Corporation (United States) , Toshiba Corporation (China) , Hisilicon Technologies Co., Ltd (China) , MediaTek Inc. (Taiwan) , Broadcom Limited (United States) , Samsung Electronics (South Korea) , Renesas Electronics Corporation (Japan) , Microchip Technology Incorporated (United States) , Marvell Technology Group, Ltd (United States) , Allwinner Technology Co., Ltd. (China)
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Key Companies Included : Collins Aerospace (United States) , Honeywell Aerospace (United States) , Thales Group (France) , BAE Systems plc (United Kingdom) , HEICO Corporation (United States) , FreeFlight Systems, Inc. (United States) , Safran S.A. (France) , The Curtiss-Wright Corporation (United States) , Saab AB (Sweden) , Lockheed Martin Corporation (United States) , Genesys Aerosystems (S-Tec Corporation) (United States) , Liebherr (Germany) , Woodward, Inc. (United States) , General Atomics (United States) , ASELSAN (Turkey)
Key Companies Included : Vonage Business (United States) , Comcast (United States) , Mitel (Canada) , Time Warner (United States) , Cablevision (United States) , Charter (United States) , 8x8 (United States) , Jive (United States) , Broadvoice (United States) , OnSIP (United States)
Key Companies Included : ADM (United States) , Cargill (United States) , Danisco (Denmark) , Soya International (United Kingdom) , American Lecithin (United States) , DowDuPont (United States) , Bunge (United States) , Now Foods (United States) , The Arnott Group (United Kingdom) , Pure Formulas (United States)
Key Companies Included : HELLA (Germany) , Continental (Germany) , Bosch (Germany) , Furukawa Electric (Japan) , NXP (Netherlands) , Vishay (United States) , Texas Instrument (United States) , Denso (Japan) , ams AG (Austria) , Inomatic (Germany) , TE Connectivity (Switzerland) , MTA (Italy) , Abertax Technologies Ltd (Malta) , Autotec Components (United Kingdom) , LEM (Switzerland)
Key Companies Included : Intel Corporation (United States) , Samsung Electronics Co., Ltd (South Korea) , Taiwan Semiconductor Manufacturing Company, Limited (Taiwan) , SK Hynix Inc. (South Korea) , Micron Technology, Inc. (United States) , Broadcom Inc. (United States) , Qualcomm Incorporated (United States) , Texas Instruments (United States) , Toshiba Corporation (Japan) , Nvidia Corporation (United States) , Panasonic Corporation (Japan) , Seiko Epson Corporation (Japan) , Spansion Inc. (United States) , United Microelectronics Corporation (Taiwan)
Key Companies Included : BOBST (Switzerland) , Absolute Engineering (United Kingdom) , Printco, Inc. (United States) , Tresu Group (United States) , Sun Automation Group (United States) , Delpro Equipments Private Limited (India) , Flxon, Inc. (United States) , Harris & Bruno International (United States) , Celmacch Group (Italy) , Kadant, Inc. (United States) , FUJI SHOKO CO., LTD (Japan)
Key Companies Included : Beckman Coulter , Roche Diagnostics , Siemens AG , Sysmex Corporation , ARKRAY
Key Companies Included : Laird Connectivity (United States) , Murata Manufacturing Co., Ltd. (Japan) , Advantech Co., Ltd. (United States) , Taiyo Yuden (United States) , Azure Wave Technologies (Taiwan) , Silicon Laboratories (United States) , Texas Instruments Incorporated (United States) , Sierra Wireless (Canada) , Grid Connect Inc. (United States) , Microchip Technology (United States) , Digi International (United States) , ZTE Corporation (China) , Huawei (China) , Silex Technology (Japan) , Espressif Systems (China) , Lantronix (United States)
Key Companies Included : Unisys Corporation (United States) , Fujitsu (Japan) , Hitachi (Japan) , Toshiba Corporation (Japan) , Super Micro Computer (United States) , Cisco Systems (United States) , Lenovo (China) , Oracle Corporation (United States) , Sun Microsystems (United States) , NEC Corporation (Japan) , Hewlett-Packard (United States) , Dell Inc. (United States) , International Business Machines Corporation (United States)